Tuesday 24 February 2015

Preference For PCB Via In Pad Among Designers Today

There are several reasons for which the designers of printed circuit board might want to adopt a different process for designing. One of the most common processes is pcb via in pad. In fact, this is the easiest and least costly process due to which the overall cost of the unit is reduced to a great extent.

Designers and manufacturers are of the view that there is no added cost for this process. Only removing the mask clearances from via can help in getting the boards tented. Tenting refers to covering the annual ring through a hole with solder mask.

The hole opening remains closed and no special procedures have to be performed for this. This process of tenting often keeps the hole remaining covered, but there is no guarantee to it. It is because of this reason that manufacturers often use smaller diameters via that offer the best chances of remaining closed.

The main purpose of manufacturing pcb via in pad is to keep the annual ring covered in order to prevent the exposure to outside elements. This in turn might reduce the accidental shorts or getting in contact with the circuit.

 In order to carry out the designing and production process with pcb via, it is always wise to make use of a fabrication note. This in turn will enable the manufacturers to know that the mask clearances have been intentionally removed from some of the vias.

Several designers and manufacturers also look forward to carrying out the process of pcb fabrication. This is highly effective and increases the efficiency and performance of the printed circuit boards. In fact, most industries demand fabricated circuit boards in order to suit the needs of the application completely. The procedure for fabrication is an extra step that does not increase the cost to a great extent.

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